Spring 2024 - Chemical Engineering 4420 " Special Topics Course"

 

 

Week 1 -  Students where introduced to the fundamentals of working in a cleanroom and reviewed machines that will be utilized during the course.

 

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Week 2 - Students began with an introduction to Ellipsometry and completed test scans followed by thin film thickness measurement

 

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Image 1 - Intro to Ellipsometry

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Image 2 - Thin Film Thickness Measurement

 




 

Week 3 -  Sample preparation began with resist spincoating, first layer exposure/alignment and microscopic inspection

 


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Image 1 - Microscopic Inspection

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Image 2 - Sample cleaning

 


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Image 3 - Sample Prep


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Image 4 -  Exposure/Alignment




Week 4 & 5 - Students prepped samples for the dopant layer application.  Next, students checked the alignment with previous markers etched in their wafers then applied the dopant layer. The organic layer of the dopant was removed by O2 Plasma then diffused into the silicon by Rapid Thermal Annealing.

 

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Image 1 - O2 Plasma Removal

 


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Image 2 - Dopant layer application

 

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Image 3 - Development

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Image 4 - Rapid Thermal Annealing